Recursive Self-Improvement for Semiconductor Engineering

Infrastructure for Recursive Silicon Intelligence.

An agent writes the circuit. Chip tools grade it. Those graded runs train the next model. The loop is built to run on machines you already control, so the design does not have to leave your network.

The Problem

Where chip teams get stuck.

01

Know-how does not compound

Each new block repeats old timing fixes. When senior engineers leave, the lessons leave too.

02

Generic AI does not know your flow

Public models never trained on your proprietary libraries, scripts, or past designs.

03

Your data has to stay private

Foundry process data comes under NDA. Design files are the company’s core asset. Neither can go to an outside AI service.

Customer Stories

Custom AI systems, built with silicon teams.

AI accelerator company

An RSI harness for accelerator design

We built a recursive self-improvement harness around the customer’s own design checks. Agents design, their tools grade every attempt, and the graded runs train a model that gets better each round. It all runs on their machines.

Networking silicon company

A model fine-tuned for their design work

We worked side by side with their engineers and fine-tuned a model on their own design data and expert corrections. The model runs inside their network and belongs to them.

Research

Work with us.

If you’re designing silicon and want to see what recursive AI can do on your workflows, we’d love to chat.

Talk with us

Team

Frontier AI and silicon engineering, in one team.

Ink and gold portrait of Jiachen Liu
AI & Training

Jiachen “Amber” Liu

Research scientist at Meta Superintelligence Lab. Machine learning research at MIT and Apple. Ph.D. in Computer Science from the University of Michigan.

Ink and gold portrait of Yiqian Min
Silicon Architecture & DV

Yiqian Min

Memory subsystem architecture for Meta’s MTIA accelerator. High-performance networking silicon at Marvell. CPU design verification on Apple A5, A6, and A7.

Our team and advisors come from

AppleMetaNVIDIAMarvellMITUniversity of Michigan

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